Electronic and Assembly Materials
- A variety of viscosity options to meet a range of application conditions
- Products specially formulated for adhesion to metal, ceramic, glass, plastic, PC, and PVC
- Fast cure for capability in high-speed production
- Excellent end use performance across a broad scope of applications
- Materials for all methods of dispensing
- Adhesion to difficult substrates, oily surfaces, and PA9T
- Fast curing materials, suitable for high-speed production
- A variety of viscosities for a wide range of processes and applications
- High reliability & optimal end-use performance
- Exceptional adhesion to similar and dissimilar substrates
- A variety of curing options, such as heat, moisture, UV, or a combination
- Solvent-free formulations
- Halogen-free formulations
- Dimensional stability
- High peel strength
- Low odor with no out-gassing
- Fast, 100% complete cure
- Outstanding chemical resistance
- Materials available to meet specifications such as UL, FDA, NSF, etc.
Más información sobre este producto consulte en: http://www.hbfuller.com/north-america/products-solutions/markets-and-applications/electronic-and-assembly-materials